The 9th Topical…

                                                  The 9th Topical Meeting on
                                      Silicon Monolithic Integrated Circuits in RF Systems
                                                      Held during the Radio and Wireless Week
                                                   January 19-21, 2009, San Diego, California, USA

                                                                       Call for Papers
                                         This 9th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2009)
                                     continues to be the only conference devoted to Si-based devices, passives, integrated circuits, and
                                     applications for high-frequency systems. Over three days, papers and sessions will highlight the
                                     significant technological advances of this dynamic field, as well as provide a unique forum for the
Conference Co-Chairs                 presentation of new ideas and candid exchange on emerging challenges and opportunities. Invited
  Guofu Niu, Auburn U.
                                     tutorial talks from international experts will be presented in key topical areas. A student paper
  Dimitrios Peroulis, Purdue U.
Technical Program Co-Chairs          competition will be held, and prizes will be given at the conference banquet.
  Basanth Jagannathan, IBM
  Donald Y.C. Lie, Texas Tech. U.    Technical papers are solicited in the following areas, but all papers related to Si-based RF systems
Publicity Chair                      are welcome:
  Sergio Pacheco, Freescale          · RF Circuits: RF Building blocks (LNA, mixer, VCO, PA, drivers, switches, filters, frequency
Publication Chair                       synthesizers), integrated transceivers, high-speed DAC and ADC, integrated transponders,
  William Chappel, Purdue U.
Student Competition Co-Chairs           analog/mixed-signal circuit blocks. Both RF CMOS and SiGe BiCMOS designs are welcome.
  Jack Ma, U. of Wisconsin-Madison   · Si Millimeter Wave ICs: millimeter wave circuits and systems for non-destructive testing,
  Xun Gong, U. of Central Florida       automotive radar, high-bit rate wireless communication, concealed weapon detection and bio-
Finance Chair                           molecular spectroscopy.
  Alex Margomenos, Toyota
Asian Coordinator                    · RF Systems and Architectures: WLAN, Bluetooth, 802.1x, Telemetry, RFID, system-on-a-chip
  Chien-Nan Kuo, NCTU                   (SoC) and system-in-a-package (SiP) solutions, integration of Si-based photonic elements.
European Coordinator                 · Devices and Modeling: physics, optimization, layout, testing, and modeling of transistors and
  Robert Weigel, U. of Erlangen         passives.
Executive Committee                  · Materials: epitaxial growth, strain engineering, characterization methods, stability issues, defects.
  John D. Cressler                   · IC Technologies: novel device structures, integration issues, heterogeneously integrated devices
  Georgia Tech
                                        and circuits, interconnects, packaging.
  Rhonda Drayton
  University of Minnesota            · Passives and MEMS: inductors, capacitors, thin film resistors, transmission lines, integrated
  Basanth Jagannathan                   antenna, transformers, RF MEMS, micro-machining for improved passives, integration with Si-
  IBM Corporation                       based circuits and systems, FBARs.
  Erich Kasper
  University of Stuttgart
                                     · Emerging Technologies: Nano, quantum, optical, and THz technology devices and circuits,
  Rudolf Lachner                        flexible RF.
  Infineon Technologies AG
  Liang-Hung Lu
  Nat'l Taiwan University
                                                          Submission Deadline: July 20, 2008
  Zhenqiang (Jack) Ma                PAPER SUBMISSION GUIDELINES
  University of Wisconsin-Madison
  Guofu Niu
                                        Authors must submit a two to four page manuscript in pdf format online and must clearly indicate
  Auburn University                  how the work advances the-state-of-the-art. Papers should include: 1) the names of all authors and
  Sergio Pacheco                     their affiliations, 2) whether this is a student paper, and 3) the mailing address, phone number, fax
  Freescale Semiconductor            number, and email address of the corresponding author. Papers submitted to SiRF 2009 must NOT be
  Dimitrios Peroulis
  Purdue University
                                     submitted to the other two conferences of the Radio and Wireless Week.
  Robert Plana
  LAAS-CNRS                          MEETING DETAILS
  George Ponchak                        This meeting will be held during the Radio and Wireless Week in San Diego, CA with joint
  NASA Glenn Research Center
                                     sessions between Radio and Wireless Symposium (RWS) and Power Amplifier Symposium (PAS). Our
  Jae-Sung Rieh
  Korea University                   popular single session format allows active interactions between all participants. A refereed IEEE
  Clemens Ruppel                     conference proceeding will be published, and a best student paper competition will be held.
  EPCOS AG                           Questions on the conference details and paper submission procedure may be found at the conference
  Katsuyoshi Washio                  web site: http://www.eng.auburn.edu/~niuguof/sirf/.
  Hitachi Ltd
  Robert Weigel
  University of Erlangen